I?m once again going to pine after the fact that we haven?t gotten the official console teardown for the PS5 that Mark Cerny promised earlier this year, but a recently published patent suggests the PS5 may use liquid metal as part of its ?lavish? cooling system for the next-gen console. At a high level, the purpose of the patent ?relates to a technique for improving cooling performance of a semiconductor device,? and further details reveal that cooling solution to be liquid metal.
Now, the first thing to understand is that this doesn?t mean the PS5 is going to have liquid metal pumping through it like a water-cooled PC or your car?s engine filled with coolant. The liquid metal acts as a heatsink in a predetermined area between the semiconductor chip and the radiator. I replaces the traditionally used grease that is usually used in electronic components. ?Instead of grease, a metal that is liquefied by heat during operation of the semiconductor chip is used as a heat conductive material between the semiconductor chip and the radiator. If such a metal is used, the thermal resistance between the semiconductor chip and the radiator is lowered, and the cooling performance of the semiconductor chip can be improved.?
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